{"id":4696,"date":"2024-01-16T18:27:48","date_gmt":"2024-01-16T17:27:48","guid":{"rendered":"https:\/\/web.infn.it\/TechTransfer\/portfolio_page\/3dsiam\/"},"modified":"2026-02-05T14:56:12","modified_gmt":"2026-02-05T13:56:12","slug":"3dsiam","status":"publish","type":"portfolio_page","link":"https:\/\/web.infn.it\/TechTransfer\/en\/portfolio_page\/3dsiam\/","title":{"rendered":"3DSIAM"},"content":{"rendered":"

[vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column][vc_raw_html]W3dwc2VvX2JyZWFkY3J1bWJd[\/vc_raw_html][vc_empty_space][vc_column_text]<\/p>\n

3DSIAM
\n<\/span><\/h1>\n

[\/vc_column_text][\/vc_column][\/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column width=”2\/3″][vc_empty_space][vc_column_text]3D geometry particle detector made from a hydrogenated amorphous silicon substrate (a-Si:H) and connected by bump bonding to an appropriate reading chip. Hydrogenated amorphous silicon gives to the detector optimal properties in terms of resistance to radiation damage, while 3D geometry allows to increase the charge collection efficiency thanks to the possibility of having a very low electrode spacing of 20-30 \u03bcm, increasing the thickness of the detector by up to 100 \u03bcm. <\/p>\n

The detector is made in two versions: one optimized for the idle detection of X-rays, ions and ionizing particles and the other, equipped with a 10B converter for neutron detection. The effective area is 20 x 10 mm2.[\/vc_column_text][vc_empty_space][vc_single_image image=”4698″ img_size=”full” qode_css_animation=””][\/vc_column][vc_column width=”1\/4″ css=”.vc_custom_1703772967700{margin-bottom: 50px !important;background-color: #042d4c !important;}” el_class=”column_details_portfolio”][vc_column_text]<\/p>\n

INFO<\/span><\/h4>\n

[\/vc_column_text][vc_empty_space][vc_column_text css=”.vc_custom_1705429444951{background-color: #042d4c !important;}”]<\/p>\n

PROJECT MANAGER<\/strong><\/h5>\n

Mauro Menichelli<\/p>\n

[\/vc_column_text][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1720701163755{background-color: #042d4c !important;}”]<\/p>\n

FACILITIES INVOLVED<\/strong><\/h5>\n

Sezione di Perugia<\/a>, Sezione di Lecce<\/a><\/strong><\/span><\/span>[\/vc_column_text][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1710859289803{background-color: #042d4c !important;}”]<\/p>\n

TECHNOLOGY SECTORS<\/strong><\/h5>\n

Detectors<\/span><\/strong>[\/vc_column_text][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1720686070240{background-color: #042d4c !important;}”]<\/p>\n

RELATED TECHNOLOGIES<\/strong><\/h5>\n

P_18.011<\/a><\/span><\/strong><\/span>[\/vc_column_text][vc_empty_space height=”21px”][vc_row_inner row_type=”row” type=”full_width” text_align=”left” css_animation=””][vc_column_inner el_class=”riga_spazio_progetti”][\/vc_column_inner][\/vc_row_inner][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1720601233876{background-color: #042d4c !important;}”]<\/p>\n

CONTACTS<\/strong><\/h5>\n

For more information about the project, WRITE TO US <\/a>[\/vc_column_text][vc_empty_space height=”21px”][\/vc_column][\/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”full_width” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern”][vc_column][vc_empty_space height=”51px”][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"

[vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column][vc_raw_html]W3dwc2VvX2JyZWFkY3J1bWJd[\/vc_raw_html][vc_empty_space][vc_column_text] 3DSIAM [\/vc_column_text][\/vc_column][\/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column width=”2\/3″][vc_empty_space][vc_column_text]3D geometry particle detector made from a hydrogenated amorphous silicon substrate (a-Si:H) and connected by bump bonding to an appropriate reading chip. 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