{"id":2405,"date":"2024-07-12T11:40:38","date_gmt":"2024-07-12T11:40:38","guid":{"rendered":"https:\/\/web.infn.it\/TechTransfer\/?post_type=portfolio_page&#038;p=2405"},"modified":"2024-09-23T14:18:09","modified_gmt":"2024-09-23T12:18:09","slug":"p_14-005","status":"publish","type":"portfolio_page","link":"https:\/\/web.infn.it\/TechTransfer\/portfolio_page\/p_14-005\/","title":{"rendered":"Guarnizione metallica da vuoto e a radiofrequenza senza brasatura"},"content":{"rendered":"<div class=\"wpb-content-wrapper\"><p>[vc_row css_animation=&#8221;&#8221; row_type=&#8221;row&#8221; use_row_as_full_screen_section=&#8221;no&#8221; type=&#8221;full_width&#8221; angled_section=&#8221;no&#8221; text_align=&#8221;left&#8221; background_image_as_pattern=&#8221;without_pattern&#8221;][vc_column][vc_raw_html]JTVCd3BzZW9fYnJlYWRjcnVtYiU1RA==[\/vc_raw_html][vc_empty_space][vc_column_text]<\/p>\n<h1>Guarnizione metallica da vuoto e a radiofrequenza senza brasatura<\/h1>\n<p>[\/vc_column_text][vc_empty_space][\/vc_column][\/vc_row][vc_row css_animation=&#8221;&#8221; row_type=&#8221;row&#8221; use_row_as_full_screen_section=&#8221;no&#8221; type=&#8221;full_width&#8221; angled_section=&#8221;no&#8221; text_align=&#8221;left&#8221; background_image_as_pattern=&#8221;without_pattern&#8221;][vc_column width=&#8221;2\/3&#8243;][vc_empty_space][vc_column_text]Questa invenzione permette l\u2019assemblaggio di strutture metalliche complesse senza l\u2019utilizzo di brasature, garantendo la tenuta del vuoto e il contatto a radiofrequenza fra i componenti.[\/vc_column_text][vc_empty_space][vc_single_image image=&#8221;2094&#8243; img_size=&#8221;full&#8221; qode_css_animation=&#8221;&#8221;][vc_empty_space][vc_column_text]<\/p>\n<h3><span style=\"color: #20415c;\">Come funziona?<\/span><\/h3>\n<p>[\/vc_column_text][vc_empty_space][vc_column_text]L\u2019invenzione si basa su due elementi: una speciale guarnizione metallica e la tecnica di assemblaggio. La guarnizione viene realizzata con lo stesso materiale dei componenti da collegare ed \u00e8 disegnata in modo da assicurare il perfetto allineamento tra le due parti, riducendo allo stesso tempo il rischio di scariche elettriche.<\/p>\n<p>L\u2019invenzione garantisce il collegamento di strutture mantenendo ultra alto vuoto fino a 10<sup>-8<\/sup> \u00f7 10<sup>-10<\/sup> mbar e continuit\u00e0 elettrica in campi RF fino a decine di MW.[\/vc_column_text][vc_empty_space][vc_column_text]<\/p>\n<h3><span style=\"color: #20415c;\">Applicazioni<\/span><\/h3>\n<p>[\/vc_column_text][vc_column_text]<\/p>\n<ul>\n<li>Manifattura di precisione e assemblaggio di sistemi in vuoto<\/li>\n<li>Realizzazione di componenti per strutture a radiofrequenza<\/li>\n<li>Acceleratori di particelle<\/li>\n<li>Reattori nucleari<\/li>\n<li>Sistemi di raffreddamento da vuoto<\/li>\n<li>Apparati per la fisica delle alte energie<\/li>\n<li>Componenti per aerospazio<\/li>\n<\/ul>\n<p>[\/vc_column_text][vc_empty_space][vc_column_text]<\/p>\n<h3><span style=\"color: #20415c;\">Vantaggi<\/span><\/h3>\n<p>[\/vc_column_text][vc_column_text]<\/p>\n<ul>\n<li>Sostituisce le brasature in vuoto, semplificando il processo e riducendo il tasso di fallimento dei componenti<\/li>\n<li>L\u2019assenza di trattamenti in forno da vuoto velocizza il processo di assemblaggio<\/li>\n<li>Sono garantite ottime prestazioni in campi a radiofrequenza ad alto gradiente<\/li>\n<\/ul>\n<p>[\/vc_column_text][\/vc_column][vc_column width=&#8221;1\/4&#8243; css=&#8221;.vc_custom_1702567488600{margin-bottom: 50px !important;background-color: #042a48 !important;}&#8221; el_class=&#8221;.column_details_portfolio&#8221;][vc_column_text]<\/p>\n<h4><span style=\"color: #ffffff;\">DETTAGLI AGGIUNTIVI<\/span><\/h4>\n<p>[\/vc_column_text][vc_empty_space][vc_column_text]<\/p>\n<h5><span style=\"color: #8bc9e0;\"><strong>PROPRIETARI DEL BREVETTO<\/strong><\/span><\/h5>\n<p style=\"color: #fff; font-weight: bold;\">INFN<\/p>\n<p>[\/vc_column_text][vc_empty_space height=&#8221;21px&#8221;][vc_column_text]<\/p>\n<h5><span style=\"color: #8bc9e0;\"><strong>NUMERO DI PRIORIT\u00c0<\/strong><\/span><\/h5>\n<p><strong><span style=\"color: #ffffff;\">IT 102015000008811<\/span><\/strong>[\/vc_column_text][vc_empty_space height=&#8221;21px&#8221;][vc_column_text]<\/p>\n<h5><span style=\"color: #8bc9e0;\"><strong>SETTORE TECNOLOGICO<\/strong><\/span><\/h5>\n<p><strong><span style=\"color: #ffffff;\">Acceleratori<\/span><\/strong>[\/vc_column_text][vc_empty_space height=&#8221;21px&#8221;][vc_column_text]<\/p>\n<h5><span style=\"color: #8bc9e0;\"><strong>CODICE TT<\/strong><\/span><\/h5>\n<p><strong><span style=\"color: #ffffff;\">P_14.005<\/span><\/strong>[\/vc_column_text][vc_empty_space][vc_row_inner row_type=&#8221;row&#8221; type=&#8221;full_width&#8221; text_align=&#8221;left&#8221; css_animation=&#8221;&#8221;][vc_column_inner el_class=&#8221;riga_spazio_progetti&#8221;][\/vc_column_inner][\/vc_row_inner][vc_empty_space][vc_column_text]<\/p>\n<h5><span style=\"color: #8bc9e0;\"><strong>CONTATTACI<\/strong><\/span><\/h5>\n<p><strong><span style=\"color: #ffffff;\">Per maggiori informazioni su questa tecnologia, <\/span><a href=\"mailto:tto@lists.infn.it\"><span style=\"text-decoration: underline;\"><strong><span style=\"color: #ffffff; text-decoration: underline;\">SCRIVICI<\/span><\/strong><\/span><\/a><\/strong>[\/vc_column_text][vc_empty_space][\/vc_column][\/vc_row][vc_row css_animation=&#8221;&#8221; row_type=&#8221;row&#8221; use_row_as_full_screen_section=&#8221;no&#8221; type=&#8221;full_width&#8221; angled_section=&#8221;no&#8221; text_align=&#8221;left&#8221; background_image_as_pattern=&#8221;without_pattern&#8221;][vc_column][vc_empty_space height=&#8221;51px&#8221;][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>[vc_row css_animation=&#8221;&#8221; row_type=&#8221;row&#8221; use_row_as_full_screen_section=&#8221;no&#8221; type=&#8221;full_width&#8221; angled_section=&#8221;no&#8221; text_align=&#8221;left&#8221; background_image_as_pattern=&#8221;without_pattern&#8221;][vc_column][vc_raw_html]JTVCd3BzZW9fYnJlYWRjcnVtYiU1RA==[\/vc_raw_html][vc_empty_space][vc_column_text] Guarnizione metallica da vuoto e a radiofrequenza senza brasatura [\/vc_column_text][vc_empty_space][\/vc_column][\/vc_row][vc_row css_animation=&#8221;&#8221; row_type=&#8221;row&#8221; use_row_as_full_screen_section=&#8221;no&#8221; type=&#8221;full_width&#8221; angled_section=&#8221;no&#8221; text_align=&#8221;left&#8221; background_image_as_pattern=&#8221;without_pattern&#8221;][vc_column width=&#8221;2\/3&#8243;][vc_empty_space][vc_column_text]Questa invenzione permette l\u2019assemblaggio di strutture metalliche complesse senza l\u2019utilizzo di brasature, garantendo la tenuta del vuoto e il contatto&#8230;<\/p>\n","protected":false},"author":4,"featured_media":1934,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","portfolio_category":[131,70,130],"portfolio_tag":[],"class_list":["post-2405","portfolio_page","type-portfolio_page","status-publish","has-post-thumbnail","hentry","portfolio_category-acceleratori-brevetti","portfolio_category-brevetti","portfolio_category-fisica-brevetti"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Guarnizione metallica da vuoto e a radiofrequenza senza brasatura - TechTransfer INFN<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/web.infn.it\/TechTransfer\/portfolio_page\/p_14-005\/\" \/>\n<meta property=\"og:locale\" content=\"it_IT\" \/>\n<meta property=\"og:type\" content=\"article\" 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