{"id":726,"date":"2024-01-16T18:27:48","date_gmt":"2024-01-16T18:27:48","guid":{"rendered":"https:\/\/web.infn.it\/TechTransfer\/?post_type=portfolio_page&p=726"},"modified":"2024-07-11T12:32:51","modified_gmt":"2024-07-11T12:32:51","slug":"3dsiam","status":"publish","type":"portfolio_page","link":"https:\/\/web.infn.it\/TechTransfer\/portfolio_page\/3dsiam\/","title":{"rendered":"3DSIAM"},"content":{"rendered":"

[vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column][vc_raw_html]JTVCd3BzZW9fYnJlYWRjcnVtYiU1RA==[\/vc_raw_html][vc_empty_space][vc_column_text]<\/p>\n

3DSIAM
\n<\/span><\/h1>\n

[\/vc_column_text][\/vc_column][\/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column width=”2\/3″][vc_empty_space][vc_column_text]Rivelatore di particelle di geometria 3D realizzato a partire da un substrato in silicio amorfo idrogenato (a-Si:H) e collegato tramite bump bonding ad un opportuno chip di lettura. Il silicio amorfo idrogenato conferisce al rivelatore propriet\u00e0 ottimali in termini di resistenza al danno da radiazione, mentre La geometria 3D consente di aumentare l\u2019efficienza di raccolta di carica grazie alla possibilit\u00e0 di avere una distanza molto bassa tra elettrodi, pari a 20-30 \u03bcm, aumentando lo spessore del rivelatore fino a 100 \u03bcm.<\/p>\n

Il rilevatore \u00e8 realizzato in due versioni: una ottimizzata per la rivelazione di raggi X, ioni e particelle ionizzanti al minimo e l\u2019altra, fornita di convertitore al 10B per la rivelazione dei neutroni. L\u2019area efficace \u00e8 di 20 x 10 mm2.[\/vc_column_text][vc_empty_space][vc_single_image image=”2067″ img_size=”full” qode_css_animation=””][\/vc_column][vc_column width=”1\/4″ css=”.vc_custom_1703772967700{margin-bottom: 50px !important;background-color: #042d4c !important;}” el_class=”column_details_portfolio”][vc_column_text]<\/p>\n

INFO<\/span><\/h4>\n

[\/vc_column_text][vc_empty_space][vc_column_text css=”.vc_custom_1705429444951{background-color: #042d4c !important;}”]<\/p>\n

RESPONSABILE PROGETTO<\/strong><\/h5>\n

Mauro Menichelli<\/p>\n

[\/vc_column_text][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1720701163755{background-color: #042d4c !important;}”]<\/p>\n

STRUTTURE COINVOLTE<\/strong><\/h5>\n

Sezione di Perugia<\/a>, Sezione di Lecce<\/a><\/strong><\/span><\/span>[\/vc_column_text][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1710859289803{background-color: #042d4c !important;}”]<\/p>\n

SETTORI TECNOLOGICI<\/strong><\/h5>\n

Rivelatori<\/span><\/strong>[\/vc_column_text][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1720686070240{background-color: #042d4c !important;}”]<\/p>\n

TECNOLOGIE COLLEGATE<\/strong><\/h5>\n

P_18.011<\/a><\/span><\/strong><\/span>[\/vc_column_text][vc_empty_space height=”21px”][vc_row_inner row_type=”row” type=”full_width” text_align=”left” css_animation=””][vc_column_inner el_class=”riga_spazio_progetti”][\/vc_column_inner][\/vc_row_inner][vc_empty_space height=”21px”][vc_column_text css=”.vc_custom_1720601233876{background-color: #042d4c !important;}”]<\/p>\n

CONTATTI<\/strong><\/h5>\n

Per maggiori informazioni sul progetto, <\/span>SCRIVICI<\/span><\/strong><\/span><\/a>[\/vc_column_text][vc_empty_space height=”21px”][\/vc_column][\/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”full_width” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern”][vc_column][vc_empty_space height=”51px”][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"

[vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column][vc_raw_html]JTVCd3BzZW9fYnJlYWRjcnVtYiU1RA==[\/vc_raw_html][vc_empty_space][vc_column_text] 3DSIAM [\/vc_column_text][\/vc_column][\/vc_row][vc_row css_animation=”” row_type=”row” use_row_as_full_screen_section=”no” type=”grid” angled_section=”no” text_align=”left” background_image_as_pattern=”without_pattern” z_index=””][vc_column width=”2\/3″][vc_empty_space][vc_column_text]Rivelatore di particelle di geometria 3D realizzato a partire da un substrato in silicio amorfo idrogenato (a-Si:H) e collegato tramite bump bonding ad un opportuno chip…<\/p>\n","protected":false},"author":1,"featured_media":2037,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","portfolio_category":[113,23,120],"portfolio_tag":[],"class_list":["post-726","portfolio_page","type-portfolio_page","status-publish","has-post-thumbnail","hentry","portfolio_category-fisica-poc","portfolio_category-poc","portfolio_category-rivelatori-poc"],"acf":[],"yoast_head":"\n3DSIAM - 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