The technology concerns the field of diode sensors, with particular reference to the radiation sensors. In particular, it finds application especially in diode radiation sensors that include one or more diodes with a charge multiplication structure, designed to operate in a linear multiplication regime.

The method concerns the construction of a diode sensor for detecting radiations. It is started with a semiconductor material, called a substrate, which has two surfaces: one front and one back. Near the front surface a first layer is created with a certain type of controlled impurity (doping), while deeper down a second layer is formed with a type of impurity opposite to the first. Before making these two layers, a third layer enriched with carbon in a precise quantity is inserted into the substrate. This step improves the characteristics of the sensor, making it more robust and reliable in detecting radiations.
INFN and FBK
IT 102022000003356
Detectors
P_21.070
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