Chemical solution for polishing copper using Plasma Electrolytic Polishing

The invention refers to the electrochemical polishing process of metal surfaces known as plasma electrolytic polishing (PEP), using a specific composition solution. The invention focuses on the ideal composition of the polishing solution and the optimal process parameters. 

How does it work?

The plasma electropolishing technique, unlike standard electropolishing, works at higher currents and potentials.

The invention in question allows a homogeneous polishing of Copper and its alloys via plasma electrolytic polishing whose results are comparable or better than those of traditional electropolishing. Polishing means increasing the reflective coefficient, the glossy effect of the surface, and decreasing micro- and macro-roughness values. In particular, the present invention makes it possible to achieve roughness values of Ra<50 nm. The invention comprises two parts: (i) the composition of the chemical solutions and (ii) the operating conditions. The set-up is similar to that of a traditional electropolishing.

Applications

• Particle accelerators;
• Aesthetic use or as a substrate for the jewellery industry;
• Chemical industry, as a preliminary treatment step to increase the corrosion resistance of copper or its alloys;
• pipes and tubing in tap fittings.

Advantages

• Greener and safer chemical composition;
• Higher process speeds;
• More effective smoothing effect.